台湾半導体大手の聯発科技、社員２割増　スマホ需要増で

2014/3/20 23:34

日本経済新聞　電子版

　【台北＝山下和成】台湾の半導体大手、聯発科技（メディアテック）は過去最大の新規雇用に踏み切る。2014年に技術者を中心に約2000人を採用し、スマートフォン（スマホ）の頭脳となる半導体の設計・開発を強化する。同社は低価格スマホ向けの製品が強みだが、今後はより上位の価格帯の需要も取り込んで同業最大手の米クアルコムを追撃する。
　メディアテックは半導体の設計・開発に特化するファブレス（工場無し）メーカ…

SONY擬擴大釋單聯發科

列入戰略性夥伴縮減零組件供應商

2014年03月21日

營運進補
【陳俐妏╱台北報導】聯發科（2454）搶攻國際品牌客戶效益續發酵，據《日經新聞》報導，SONY將調整零組件採購策略，縮減零組件供應商，聚焦250家戰略供應商，聯發科列入晶片合作夥伴，外界聯想，若SONY擴大採用聯發科手機晶片，將激勵出貨。

聯發科去年以4核心晶片打入SONY Xperia C供應鏈，由於Xperia C銷量不錯，被視為聯發科突破高通防線的關鍵一戰，今年SONY相關智慧手機產品可望繼續採用聯發科方案，後續8核心產品也有機會入列。此外，日系 Panasonic復出消費性手機產品之作P31，也是採用聯發科4核心MT6582M 1.3GHz處理器。

3年內比重將逾50%

據《日經新聞》報導指出，SONY此次列入採購改革的對象為無線相關零件、感測器半導體及面板等10種可左右智慧手機、數位相機、遊戲機等核心電子產品關鍵零件，將針對各核心零件挑選出2~3家全球大廠作為戰略性夥伴，台廠聯發科、友達（2409）已入列，藉由此次改革，預估2~3年內，SONY向戰略性夥伴的採購比重將提升至50%以上水準。
除未來可望受惠SONY訂單外，小米已公布向三星嗆聲的5.5吋紅米NOTE手機價格，搭載聯發科8核心晶片，普通版同樣下殺799元人民幣（約3920元台幣），從20日晚上開放搶購資格後，短短1天內已逾600萬人次預約，未來開賣後，將帶動聯發科8核心晶片同步放量。
聯發科也進行多元化布局，外傳中國移動電子商務平台買賣寶日前進行增資，聯發科也投資入股，聯發科主管證實此事，表示是旗下創投策略性投資。
其實聯發科創新布局相當積極，改國際識別LOGO、換上新的英文網頁，從消費產品幕後大步跨向台前，聯發科主管表示，主要是由旗下創投資金進行投資，聯發科旗下CMC創投會尋找好的企業及創新投資標的，這次投入金額不高，約150萬美元（約4575萬台幣），但不會在財報揭露。

策略性投資買賣寶

資料顯示，今年初買賣寶推智慧手機Q1，採用聯發科4核心晶片，售價899元人民幣（約4405元台幣），算是聯發科合作夥伴，這次買賣寶增資主要用於戰略級新業務大Q手機拓展，及全國範圍倉儲網路建設，而聯發科不僅是戰略合作夥伴，更入股買賣寶，擴大在電子商務領域布局。
巴克萊資本證券亞太區半導體首席分析師陸行之近期發表報告指出，在8核心晶片帶動下，看好聯發科首季營收超標季增13~15%，未來幾年受惠新興市場低階晶片驅動、8核心和5模 4G產品推升單價，預估今、明年每股獲利複合成長率達17~19%，將目標價從490元上調至525元。

聯發科近期多空訊息

●利空
◎中國移動4G LTE晶片補貼從3模轉進5模，聯發科LTE數據晶片MT6290要等Q2~Q3通過3模認證，Q4再通過5模認證，高通方案可能有時間優勢
◎傳Q2營收可能較Q1小幅衰退
●利多
◎未來幾年受惠新興市場低階IC驅動，中國市場在8核心和5模4G產品推升單價，將帶動聯發科獲利提升
◎今年中國LTE手機市場可達1~1.4億支規模，聯發科5模產品下半年起飛貢獻營收
◎可能與SONY擴大合作
資料來源：法人、記者整理
2013.1

聯發科技股份有限公司（MediaTek Inc.），簡稱聯發科（MTK），成立於1997年，總公司設在台灣 新竹科學工業園區，是一家Fabless IC設計公司，公司初期以光碟機晶片為主，其後發展了手機及數位電視晶片。

Taiwanese Chip Maker Challenges Apple in China

By LIN YANG

TAIPEI — MediaTek not only provides manufacturers with chips for their smartphones, but also tells how to build and run them, cutting costs as they compete with the iPhone.

PAINFUL TEST FOR TAIWAN'S CHIPMAKERS

By Robin Kwong in Taipei , Robin Harding in Tokyo 2009-07-24

Changes in the technology sector have typically been good news for Taiwan's chipmakers.
Since the government set up Taiwan Semiconductor Manufacturing Company and United Microelectronics Company in the 1980s, the Taiwan semiconductor industry has grown to become the world's chip factory.
Navin Shenoy, general manager for Intel in Asia Pacific, says this was largely achieved through “winning in transition”.
Taiwan semiconductor groups and their computer makers “were very smart to get on board early” in the shift from desktop to notebook computing.
They held on to their lead by continuing to invest even in troubled times, such as the Asia financial crisis in the late 1990s and the bursting of the tech bubble.
But Taiwan has suffered its worst-ever falls in exports and economic performance in the past half year, and the economic crisis is testing the island's chipmakers' resilience.
Taiwan semiconductor vendors saw their revenues fall 8.7 per cent last year to $14.89bn, a steeper drop than the global average of 5.4 per cent, according to Gartner.
Among the worst hit were D-Ram memory chip groups, which had already been dealing with industry overcapacity.
Taiwan's D-Ram companies are desperately raising capital, while the government has established Taiwan Memory Company to reform the industry.
Taiwan Memory, which has chosen Japan's Elpida as partner, has said it hopes to develop more customised, higher-margin memory chips but has given few details on how it plans to do so.
Taiwan said yesterday it would extend state funds to local makers of D-Ram chips provided they could demonstrate plans to develop technology with foreign groups and propose restructuring options, such as mergers or acquisitions that would benefit the wider industry.
Beyond the memory chip industry, Taiwan's top chipmakers are scrambling to adapt to industry changes in the hope of emerging stronger from the crisis.
TSMC, which managed to remain profitable but saw its biggest-ever revenue drop in the first quarter of this year, is considering diversifying away from chips for the first time in its 22-year history.
Rick Tsai, the former chief executive, was named head of a unit to explore options in the green energy and LED lighting sectors.
TSMC, the world's biggest contract chipmaker, has appealed to clients to co-operate on research and development efforts.
The company, which will make available some of its research and development to clients, hopes co-operation will help contain the escalating costs of designing and producing ever more complicated chips.
TSMC was one of the first big chipmakers to restore investment plans that had been curtailed by the downturn, and is expanding its R&D team.
Bhavtosh Vajpayee, analyst at CLSA, said TSMC would also probably benefit from increased outsourcing by integrated design manufacturers.
Such companies, which include businesses such as STMicroelectronics and Intel, outsource less than 10 per cent of their production but are expected to do so increasingly given the rising cost and complexity of making advanced chips.
“TSMC's massive lead in technology and rising competitive leadership within the industry has helped it grab at least 56 per cent of the IDM [Integrated Device Manufacturers] outsourcing shift since 2001, and this is set to grow further,” Mr Vajpayee said in a recent note.
TSMC has signed an outsourcing deal with Japan's Fujitsu to produce future Fujitsu chips, allowing the Japanese company gradually to run down its domestic plants and quit parts of the semiconductor business where it cannot make money.

Mainland tempts makers to set up shop and offers vital market

The mainland is a growing force in chip manufacturing.
Intel's first semiconductor plant in China is expected to begin production next year.
Taiwan's United Microelectronics Corp, the world's second-biggest contract chipmaker, plans to acquire the rest of Hejian Technology, a Chinese foundry in which it holds a 15 per cent stake.
“We believe a production base in China is essential,” said Richard Yu of UMC.
“China's market was relatively strong even during [the global economic crisis], attracting many customers that preferred the option of local production.”
But China's domestic foundries are years away from mounting a serious challenge to their Taiwan counterparts, partly because of restrictions on technology transfer by the US and Taiwan governments.
Nearly all China's domestic foundries are struggling to stay profitable.
An advantage of being in Taiwan, according to Mr Yu, is that “the critical mass of semiconductor companies in Taiwan has really helped us optimise our operating efficiency.
“Within Taiwan's dedicated science parks in Hsinchu and Tainan, there are companies that represent the full spectrum of the semiconductor supply chain to fulfil industry needs”.
But China is becoming a vital market for Taiwan's semiconductor groups.
Donald Lu at Goldman Sachs estimates that China accounts for 13 per cent of demand for the contract chipmakers, meaning “demand from China and other emerging markets has become as important as demand from developed countries”.

分析：台湾芯片制造商面临考验

作者：英国《金融时报》邝彦晖(Robin Kwong)台北、罗宾•哈丁( Robin Harding) 东京报道 2009-07-24
一般来说，对于台湾芯片制造商而言，科技行业的变革是好消息。
自从上世纪80年代，台湾政府成立台积电(TSMC)和联华电子(United Microelectronics Company)以来，台湾半导体行业已发展成为世界芯片工厂。
英特尔(Intel)亚太区总裁孙纳颐(Navin Shenoy)表示，这基本上是通过“赢在转型”而实现的。

在从台式电脑向笔记本电脑的转型过程中，台湾半导体集团和电脑制造商“非常明智地提前参与了进来”。
通过持续投资，它们一直保持着领先地位，甚至在困难时期也是如此，例如上世纪90年代末的亚洲金融危机以及科技泡沫破裂时期。
但过去半年，台湾的出口和经济表现遭遇了最严重滑坡，此次经济危机正在考验台湾芯片制造商的适应能力。
Gartner的数据显示，去年，台湾半导体公司的收入减少8.7%，至148.9亿美元，较5.4%的全球平均水平有大幅下跌。
其中受打击最严重的是动态随机存取存储器(D-Ram)芯片企业集团，它们已经在应对行业产能过剩问题。
台湾的D-Ram企业正拼命融资，与此同时，台湾政府成立了台湾记忆体公司(Taiwan Memory Company)，以改革D-Ram芯片行业。
台湾记忆体公司已选择日本的尔必达(Elpida)作为合作伙伴，该公司表示，希望研制定制化程度更高、利润率更高的存储芯片，但该公司没有详细透露计划如何做到这点。
7月21日，台湾政府表示，只要本地D-Ram芯片制造商能够证明其有计划与外国企业合作开发技术，并提出重组选择，例如将令行业广泛受益的并购方案，那么政府将向这些公司提供政府资金。
在存储芯片行业以外，台湾最大芯片制造商正忙于适应行业变革，以期在此次危机结束之后以更为强大的姿态崛起。
台积电设法维持了盈利能力，但今年第一季度其收入出现历史最大降幅，该公司正考虑从芯片领域转移，推行业务多元化，这是该公司22年历史上的首次。
台积电前首席执行官蔡力行(Rick Tsai)被任命为一个新部门的主管，该部门负责探索绿色能源和发光二极管(LED)照明行业的选择。
台积电是全球最大代工芯片制造商。该公司呼吁客户在研发工作中展开合作。
台积电将把部分研发工作向客户公开，希望这种合作将有利于控制因设计和生产更为复杂的芯片而不断上升的成本。
台积电是恢复投资计划的首批大型芯片制造商之一，这些计划由于经济低迷遭到缩减，此外该公司正扩充研发团队。
里昂证券(CLSA)分析师巴夫托什•瓦杰帕伊(Bhavtosh Vajpayee)表示，集成设计制造商扩大外包的做法也可能令台积电受益。
包括意法半导体(STmicroelectronics)和英特尔等公司在内的这类公司目前外包的生产业务比例不到10%，但由于成本不断上升且制造高级芯片相当复杂，预计它们将把越来越多的生产业务外包出去。
瓦杰帕伊在最近的一份报告中称：“自2001年以来，台积电在技术方面的巨大领先地位以及在行业内部不断上升的竞争性领导地位，帮助该公司斩获了集成器件制造商(IDM) 至少56%的外包业务，而且这一比例将继续上升。”
台积电已与日本富士通(Fujitsu)签订外包协议，以后富士通的芯片将由其制造，这令富士通得以逐步关闭其国内工厂，并放弃无法赢利的部分半导体业务。富士通的半导体部门去年亏损达719亿日元。
其它台湾公司都迅速针对这场危机做出了调整。
台湾最大芯片设计公司联发科技(MediaTek)是中国大陆手机芯片的最大供应商，该公司正协助将中国大陆的手机行业打造为面向俄罗斯、印度和非洲等新兴市场的出口基地。

中国大陆吸引台湾芯片制造商在大陆建厂并提供重要市场

中国大陆是芯片制造业一支日益强大的力量。
英特尔在华首家半导体工厂预计于明年投产。
全球第二大代工芯片制造商台湾联华电子计划收购和舰科技(Hejian Technology)剩余股权。联华电子原本持有和舰科技15%的股权。
联华电子的Richard Yu表示：“我们认为，在中国大陆建立生产基地至关重要。”
“中国大陆市场相对强劲，甚至在（此次全球经济危机）期间也是如此，这吸引了很多青睐本地化生产选择的客户。”
但要向台湾芯片制造商发起有力挑战，中国大陆的同行还需要数年时间，部分原因在于美国和台湾政府针对技术转让的限制。
几乎所有中国大陆的芯片制造商都难以保持盈利能力。
Richard Yu表示，身在台湾的一个优势是，“台湾半导体公司的临界规模确实有利于我们优化我们的运营效率。”
“在台湾新竹和台南的专业科技园里，有些公司合在一起能够覆盖半导体的整个供应链，足以满足行业需求。”
但中国大陆正成为台湾半导体集团的关键市场。
高盛(Goldman Sachs)分析师吕东风(Donald Lu)估计，中国大陆占代工芯片制造商需求的13%，这意味着“中国大陆和其它新兴市场的需求可能会变得与发达国家一样重要”。
译者/梁艳裳

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2014年3月22日星期六